Xeltek Programmers & Electronics Tools on ICGOODFIND SiteMap
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- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
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- Musk: Tesla AI6 Chip Could Set a New Record for Compute per Wafer
- TSMC 3nm Capacity Hits 175K Wafers/Month Yet Still Tight, H2 Price Hike Up to 15%
- AWS Launches Graviton5: 3nm, 192 Cores, DDR5‑8800, PCIe Gen 6 – First 3nm Cloud Arm CPU
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- Shenzhen Huaqiang Confirms Price Hikes on Some HiSilicon Chips, Sees Broad Component Upturn
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Preface
- Synopsys Rolls Out TSMC N6C/N4C IP Portfolio for Cost‑Optimized AI Chips
- Qualcomm Rolls Out IQ10 Robot Reference Design with up to 700 TOPS for Industrial and Humanoid Bots
- Nvidia N1 Series Arm SoC Specs Leak: N1X and N1 Chips for PC Platform
- Samsung Delivers Industry’s First 12‑Stack HBM4E Samples: 48GB, 3.6TB/s
- ChangXin Memory IPO Clears STAR Market Review, Plans $4.1B Raise
- Kingboard Laminate Raises PCB Material Prices by up to 20% as Raw Material Costs Bite
- NXP 74AUP1G00GW: A Low-Power Single 2-Input NAND Gate for Advanced CMOS Applications
- NXP BGU7007: A High-Performance GPS Low-Noise Amplifier for Precision Applications
- NXP BZX84-B13: A Comprehensive Technical Overview of the 13V Zener Diode
- NXP BC817-16W: A Comprehensive Technical Overview of the SOT-323 General Purpose NPN Transistor
- NXP 74HC2G02DP: A Comprehensive Technical Overview of the Dual 2-Input NOR Gate IC
- NXP PH6030DLB: A Comprehensive Technical Overview of its Architecture and Applications
- NXP MFRC63001HN: A Comprehensive Technical Overview of its High-Frequency NFC Reader IC Architecture
- NXP 74HCT123PW Monostable Multivibrator: Key Features, Applications, and Usage Considerations
- Domestic MEMS Chip‑Level Fan Cools CPU with Near‑Zero Noise – China’s Thermal Breakthrough
- Samsung’s Non‑Chip Workers Seek Court Order Over Vast Pay Gap vs Semiconductor Staff
- Unigroup Guoxin Buys Raynen Semiconductor for $263M to Boost Power Semi IDM
- TSMC Targets Panel‑Level Packaging with CoPoS Platform, Mass Production by 2028
- US FTC Launches Antitrust Probe into Arm Over Licensing Practices
- Power Management IC Prices Rise as Foundry, Assembly Costs Bite – PMIC Makers Set for H2 Upside
- NXP 74LVC125AD: A Comprehensive Technical Overview of the Quad Buffer IC
- NXP 74AHC14PW: A Comprehensive Technical Overview of the Hex Inverting Schmitt-Trigger IC
- NXP 74LVC138APW: A 3-to-8 Line Decoder/Demultiplexer for High-Performance Digital Systems
- NXP BC857BW: A Comprehensive Technical Overview of the General-Purpose PNP Transistor
- SMIC Q1 Revenue Hits Record $2.505B, Guides 14–16% Growth in Q2
- NXP BZX84-C20: A Comprehensive Technical Overview of the 20V Zener Diode
- NXP 74LVC08AD: A Comprehensive Technical Overview of the Quad 2-Input AND Gate
- The PCF8574AT Remote 8-bit I/O Expander for I2C-bus with Interrupt
- NXP MC33771BSP1AE: A Comprehensive Technical Overview of its Architecture and Automotive Applications
- Tencent to Boost Domestic AI Chip Usage in H2 2026, Scaling Huawei Ascend and More
- ams OSRAM Sells CMOS Image Sensor Business to indie Semiconductor for €40M
- US Reveals $2.5B Nvidia GPU Smuggling Ring: Bangkok’s OBON Named as ‘Company-1’
- NXP 74HCT374N: A Detailed Overview of the High-Speed CMOS Octal D-Type Flip-Flop
- The NXP MCIMX6D6AVT10AER is a system-on-chip (SoC) belonging to the renowned i.MX 6 series, specifically the i.MX 6DualPlus application processor. This component is engineered for high-performance, lo
- Unlocking the Potential of the NXP MKL27Z256VFM4 Ultra-Low-Power Arm Cortex-M0+ Microcontroller
- NXP TJA1055T/C: A High-Performance, Fault-Tolerant CAN Transceiver for Automotive Networks
- NXP 74HC4051D-Q100: A High-Performance CMOS Analog Multiplexer/Demultiplexer for Automotive and Industrial Applications
- NXP MC9S08AC16CFGE: An In-Depth Technical Overview of the 8-bit HCS08 Microcontroller Family
- NXP BTA216-800B: A Comprehensive Technical Overview of the 800V Logic Level TRIAC
- NXP 74LVC2G17GM: A Deep Dive into its Features, Applications, and Benefits
- Sunlord’s AI Inductors Enter Mass Production, Tantalum Caps Ramp Up in eSSD and Data Centers
- Murata to Invest ¥80 Billion in MLCC Expansion, Targets Data Center Demand
- India Approves Two New Semiconductor Projects – Enters GaN Foundry Race
- Apple Courts Intel & Samsung for Chip Foundry as Samsung Hits $1 Trillion
- NXP BC847BPN,115: General-Purpose NPN Transistor for Compact Circuit Design
- NXP LPC4088FBD208K: A High-Performance ARM Cortex-M4 Microcontroller for Advanced Embedded Applications
- High-Power RF Amplification with NXP's MRF6V12500HR5 LDMOS Transistor for Industrial and Scientific Applications
- NXP MMPF0100F0ANES: A Comprehensive Power Management IC for Advanced Applications
- NXP UDA1361TS/N1: A Technical Overview of the Legacy Stereo Audio Codec
- NXP PESD5V0L5UV: Ultra-Low Capacitance ESD Protection Diode for High-Speed Data Lines
- Quadruple 2-Input NOR Gate: An In-Depth Look at the NXP 74HC02PW
- NXP MC33PF8200D2ES: A Comprehensive System Basis Chip for Next-Generation Automotive Applications
- Xiamen Silan Jihua Gets 1,944% Capital Injection – $700M for 12‑Inch Analog Fab
- NX5P3290UKZ: NXP's Advanced Load Switch for Robust Power Management and System Protection
- The NXP FS32R274KSK2MMM is a highly integrated System-on-Chip (SoC) designed specifically for next-generation automotive radar applications. As a cornerstone of Advanced Driver-Assistance Systems (ADA
- NXP 74HCT245PW: A Comprehensive Technical Overview of the High-Speed CMOS Octal Bus Transceiver
- NXP MC33FS6523NAE: A Comprehensive System Basis Chip for Next-Generation Automotive Body Domain Controllers
- NXP SA614AD/01: A Comprehensive Technical Overview of the FM IF System IC
- NXP MRFE6VS25GNR1 LDMOS Transistor: High-Power RF Amplification for Industrial and Scientific Applications
- NXP MKV30F128VFM10: A 32-bit Microcontroller for Robust Automotive and Industrial Applications
- NXP PESD5V0L1BA: Ultra-Low Capacitance ESD Protection Diode for High-Speed Data Lines
- NXP Q1 Revenue Rises 12%, Net Profit Doubles – Auto & Industrial Rebound
- Tri-Circuit’s 1μm MLCC Breakthrough – $9B Revenue Hides a High-End Secret
- VeriSilicon’s Orders Explode to $4.5B – AI ASIC Drives 85% of New Deals
- China IC Fund Cuts Stake in Techbond – Third Sale in 12 Months
- 8-Inch Wafer Foundry Price Hikes Spread – DB HiTek, SMIC, UMC, PSMC, Vanguard All In
- Revenue Hits $1.12B – Xinlian Integration Stays China‘s #1 MEMS Foundry
- Unisoc IPO Gains Speed – Poised to Become China’s First Smartphone Chip Stock
- TSMC’s CC Wei Unveils Advanced Packaging Edge, CoWoS Monthly Capacity to Hit 170,000 Wafers by 2027
- China’s First RISC-V+AI+Post-Quantum Automotive MCU Chip Debuts – CCRC4XXX Series
- Apple Supplier Rejects Additional iPhone 18 Pro Lens Orders – Rare Move Shakes Supply Chain
- Actions Microelectronics 2025 Net Profit Surges 91.95%, Edge AI Becomes Key Growth Driver
- Allwinner Q1 Net Profit Soars Over 238% on Strong Demand
- Complete Guide to Electronic Component Letter Symbols (Detailed Explanation by ICGOODFIND)
- Naxin Micro 2025 Revenue Soars 71.8% to $4.6B
- Naxin Micro 2025 Revenue Soars 71.8% to $4.6B
- GTA Semiconductor & Infineon Team Up for Embedded Memory Push
- ICGOODFIND Talks About China's Automotive Chip Market Sales Ranking in March 2026
- Altera Extends FPGA Lifecycles to 2045
- KIOXIA Ends Production of Multiple NAND Flash Lines
- Rapidus Announces New Advanced Process Development to Compete With TSMC
- Samsung’s Xi’an Fab Begins Mass Production of V8 (236-Layer) 3D NAND
- 3PEAK Launches First Domestic Single-Die High-Side Switc
- ICGOODFINDN is here to walk you through the detailed selection guide for Allegro's core chips
- TSMC Exits GaN, Samsung Moves In